Currently, the team comprises of 2 professors, 15 senior engineers, and other professionals. The team members graduated from prestigious domestic universities such as the University of Science and Technology Beijing and Harbin Institute of Technology, with extensive expertise in magnetic functional materials, MEMS technology, chip circuit design, among others.

Project Introduction

This project has conducted extensive research and development on high impedance change rate amorphous filament materials and their optimization of magnetic properties, GMI-MEMS manufacturing processes, and SoC integration. The high-performance amorphous filament material with a high impedance change rate has been successfully developed and is capable of batch preparation. By utilizing this advanced amorphous filament material in combination with precision coil winding and assembly processes, as well as low noise analog circuit design, we have successfully developed an extremely sensitive weak magnetic sensor module with pT-class sensitivity. Application demonstrations have been carried out in various fields including smart grid, intelligent transportation, high-end medical applications.

Based on the typical non-silicon MEMS process combined with electroplating, magnetron sputtering, LIGA deep etching technology and GMI amorphous wire high-precision assembly techniques，we have successfully developed the first domestic GMI-MEMS weak magnetic core chip. Leveraging the comprehensive material analysis capabilities along with characterization techniques and semiconductor processing conditions available at Songshan Lake Materials Laboratory，we have completed the SoC chip integration of GMI-MEMS and ASIC signal processing circuits using SIP packaging technology.

After years of technical accumulation, our team has established three generations of Hall effect sensors (Hall), magnetoresistive sensors (MR), giant magnetoimpedance sensors (GMI) along with corresponding magnetic materials for different application scenarios. We possess batch production capacity for intelligent magnetic sensor chips which promotes industrial applications in automotive electronics, power grids, and intelligent manufacturing fields.

Product Market

1、Automotive electronics field

Automotive electronics is the largest market for sensors, and the demand for automotive gauge magnetic sensor chips and modules such as engine speed, position, displacement, electric vehicle current, and voltage continues to increase.

2、Smart grid field

With the demand of wind power, photovoltaic and grid digitization, the high-precision measurement of electricity volume has a broad market demand in the field of smart grid.

 3、Biomedical field

It is a new direction of medical magnetic measurement to measure the weak magnetic field signals such as magnetocardio and magnetoencephalia in non-magnetic shielding environment and to measure the magnetic particles of biological agents by GMI.

Research Direction

1、High impedance change rate of amorphous wire

2、The core technology of MEMS process and ASIC conditioning circuit is applied to the sensitive components of Hall, magnetoresistive, and GMI weak magnetic sensor chips.

3、Highly reliable vehicle gauge magnetic-sensitive chip

4、Chip - module -CPS system integration application